节点文献
电沉积铜的工艺参数对镀层硬度及电阻率的影响
Effect of Process Variable on Hardness of Electrodepositing Copper Coating
【摘要】 通过改变镀铜工艺中的阴极电流密度参数 ,测定所获得镀铜层的硬度及电阻率 ,发现阴极电流密度与镀铜层的硬度及电阻率之间的变化趋势 ,硬度与电阻率的时间效应。并从理论上给予解释
【Abstract】 The hardness and resistivity of copper electroplating under various cathodic current densities were measured. The relations between the current density and hardness and resistivity, as well as the effects of time were discussed. And the results were explained theoretically.
【基金】 科技部地方重大科技攻关项目资助
- 【文献出处】 材料保护 ,Materiais Protection , 编辑部邮箱 ,2002年11期
- 【分类号】TQ153.1
- 【被引频次】13
- 【下载频次】338