节点文献
酞菁染料与氯离子协同效应在酸性镀铜中的作用
Synergistic Effect of Chloride Ion and Copper Phthalocyanine in Acid Copper Plating
【摘要】 采用旋转圆盘电极和交流阻抗方法研究酞菁染料 (PC)及其与氯离子协同效应对酸性镀铜电沉积过程的影响 ,通过选择不同浓度的酞菁染料 ,研究它们在不同转速下的阴极极化行为和交流阻抗图谱 ,对其在电极表面的成膜状态作了深入研究。极化的电位从自然电位到 - 0 .6V(相对SCUE)。结果表明 ,PC在酸铜电镀中所起的作用更多依赖于其在表面形成吸附膜的结构 ,而非单纯的电荷吸引。
【Abstract】 The rotating disk electrode and impedance methods were used to investigate the synergistic effects of copper phthalocyanine (PC) and Cl - on copper electrodepositing in acid copper sulfate solution. The films formed on electrode were studied with different copper phthalocyanine concentration under various rotation rates by polarization curves and EIS. Polarization potential was between rest potential and -0.6 V (vs SCUE). Results showed that the effect of PC in plating was depended on the structure of surface film, but not simple electric attraction.
【Key words】 acid copper plating; copper phthalocyanine; impedance; rotating disk electrode;
- 【文献出处】 材料保护 ,Materiais Protection , 编辑部邮箱 ,2002年05期
- 【分类号】TQ153
- 【被引频次】23
- 【下载频次】219