【摘要】 本文论述了多晶硅高温压力传感器中的硅 玻璃静电键合技术 ,包括硅 玻璃静电键合机理 ,键合强度及键合后残余应力的改善措施 .通过大批量键合封接实验 ,键合的成品率达到 95 %以上更多还原

【Abstract】 This paper mainly discusses one main technology of high-temperature polysilicon pressure sensor:Si-Glass anodic bonding, including its principle, bonding strength and measurements to lower the residual stress causing by bonding. By making lots of experiments, the qualification rate can reach 95%.更多还原