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300mm硅单晶的缩颈生长及应力分析

Necking-down Growth and Stress Analysis for 300 mm CZ Silicon Single Crystals

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【作者】 程景柏屠海令周旗钢王敬常青张果虎方锋

【Author】 Cheng Jingbo,Tu Hailing,Zhou Qigang,Wang Jing,Chang Qing,Zhang Guohu and Fang Feng (General Research Institute for Nonferrous Metals,Beijing 100088,China)

【机构】 北京有色金属研究总院!北京100088

【摘要】 对不同直径颈部晶体进行了拉伸实验及断口形貌观察 ,颈部晶体的断裂属于脆性断裂 ,增大晶体颈部直径可以增大其承受拉力 ,从而可以制得更大重量的单晶。缩颈生长工艺条件会对颈部晶体的抗拉强度产生影响。讨论了颈部晶体的断裂机制

【Abstract】 Tensile tests for the neckings with different diameters were made, and then the fracture morphology of the neckings was analyzed by scanning electron microscopy(SEM). The surface morphology demonstrates that the fracture is fragile. The large seeds can support crystals grown from large poly silicon charge sizes. It is indicated that the necking down growth conditions have certain effects on the tensile stress limit of the neckings. The fracture mechanism of neckings was discussed.

【关键词】 300mm硅单晶缩颈脆性断裂抗拉强度
【Key words】 mm silicon single crystalNeckingFractureTensile
  • 【文献出处】 稀有金属 ,Chinese Journal of Rare Metals , 编辑部邮箱 ,2001年04期
  • 【分类号】TN304
  • 【被引频次】7
  • 【下载频次】183
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