【摘要】 介绍了用于真空电子器件封接的高频钎焊设备的结构及设计难点 ,该设备可方便更换感应线圈以焊接不同规格尺寸的零部件更多还原

【Abstract】 This paper introduces the structure and design considerations of a high frequency brazing equipment used in sealing of vacuum electronic devices and difficulties in design,It is shown that by exchange inductive coils this equipment can conveniently to seal different sizes of component part.更多还原