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硅基PZT薄膜的制备与刻蚀工艺研究
Study of Fabrication and Etching Processes of PZT Thin Films on Silicon
【摘要】 采用溶胶 -凝胶 ( Sol- Gel)法制备了 PZT薄膜 ,在 60 0°C的退火温度下即获得了晶化完善的钙钛矿铁电相结构。采用典型的半导体光刻工艺 ,利用 HCl/ HF刻蚀溶液成功地获得刻蚀线条分辨率达微米量级的 PZT薄膜微图形。较好的解决了有关 PZT薄膜制备与加工中存在的关键问题 ,为硅基铁电薄膜器件的实现奠定了良好的工艺基础。
【Abstract】 Lead-zirconate-titanate (PZT) thin films on silicon were prepared by a Sol-Gel methodIt was shown that the PZT thin films had perfect perovskite ferroelectric structure at annealing temperature of 600 °C by X-ray diffraction analysis (XRD)PZT thin films were chemically etched using HCl/HF solution after typical semiconductor lithographic processThe SEM results indicated that the PZT etching problem was well resolved for the application of PZT thin film devices
【基金】 国家自然科学基金资助项目 ( 6980 60 0 7) ;国家“九七三”计划资助项目 ( G19990 3310 5 )
- 【文献出处】 压电与声光 ,Piezoelectrics & Acoustooptics , 编辑部邮箱 ,2001年04期
- 【分类号】TN384
- 【被引频次】26
- 【下载频次】354