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脉冲溅射技术在氧化铝薄膜沉积中的应用

Application of Pulsed Sputtering Technology in Aluminum Oxide Films Deposition

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【作者】 茅昕辉蔡炳初陈国平

【Author】 MAO Xin-hui1,CAI Bing-chu1,CHEN Guo-ping2 (1Information Storage Research Center of Shanghai Jiao Tong University,Thin Films and Microfabrication Open Laboratory of Education Ministry,Shanghai200030,China; 2 The Films Institute,Southeast University,Nan

【机构】 上海交通大学信息存储研究中心!薄膜与微细技术教育部开发实验室上海200030东南大学薄膜研究所!南京210096

【摘要】 脉冲溅射是一种新型的、用于消除直流反应溅射中异常放电的技术。通过采用金属铝靶和自制的脉冲电源进行了氧化铝薄膜的脉冲磁控反应溅射沉积实验 ,讨论了脉冲溅射参数对异常放电的抑制效果 ,以及对氧化铝薄膜的沉积速率和折射率的影响。

【Abstract】 Pulsed sputtering is a new kind of technology used to eliminate the abnormal discharge during DC reactive sputtering.Aluminum oxide films were prepared by pulsed magnetron reactive sputtering with a metal aluminum target and a self-made pulsed power supply.The relation between the abnormal discharge’s suppression and the pulsed sputtering parameters was given.The effects of sputtering parameters on the deposition rate and the refractive index of aluminum oxide film were also described in detail.

  • 【文献出处】 微细加工技术 ,Microfabrication Technology , 编辑部邮箱 ,2001年02期
  • 【分类号】TN305.92
  • 【被引频次】17
  • 【下载频次】258
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