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NiTi形状记忆合金薄膜的残余应力
Residual Stress Study of NiTi Shape Memory Alloy Thin Films
【摘要】 采用 X射线掠射法和轮廓法 ,测量了单晶 Si基板上用磁控溅射法制备的 Ni Ti形状记忆合金薄膜的残余应力 ,分析了其与薄膜厚度以及晶化处理温度等工艺条件的关系 .结果表明 :该薄膜中的残余应力主要来源于薄膜同基板材料的膨胀系数和晶格参数不匹配 ;薄膜厚度越大 ,残余应力越小 ;晶化处理温度对因热胀系数差异带来的热拉应力因马氏体相变而致的相变压应力均有不同程度的影响 .
【Abstract】 Residual stress in NiTi shape memory alloy thin film was measured by X ray glancing and contour method separately. The effect of annealing temperature and film thickness on residual stress was also analyzed. The derivative of the residual stress is mainly the dismatch of expansion coefficient and crystal parameters. The thicker the film is, the lower the residual stress is. And the influence of annealing temperature was also found to be caused by the expansion coefficient difference and martensitic transition.
【基金】 国家教育部薄膜与微细加工技术开放实验室资助
- 【文献出处】 上海交通大学学报 ,Journal of Shanghai Jiaotong University , 编辑部邮箱 ,2001年03期
- 【分类号】TG139.6
- 【被引频次】21
- 【下载频次】245