【摘要】 通过接头界面结构分析和强度测试研究了 Ti/ Ni/Ti复合层过渡液相 (TL P)扩散连接 Si3N4陶瓷的结合机理。结果表明 ,Ni- Ti过渡液相存在时间短 ,在此期间形成的界面结合强度低 ;但通过施加足够大的压力 ,能保证液相凝固后连接层金属与陶瓷之间形成大量的扩散通道 ,为进一步固态扩散反应提供了良好的条件。固态反应充分且强度高的接头结合区的显微结构为 :Si3N4/ Ti N/ Ti5 Si3+ Ti5 Si4+ Ni3Si/Ni Ti/ Ni3Ti/ Ni。界面高强度结合的标志是形成了一层连续的 Ti N。更多还原

【Abstract】 The mechanism of transient liquid phase (TLP) diffusion bonding of Si 3N 4 ceramics with multiple Ti/Ni/Ti interlayers was investigated by analyzing the interfacial microstructures and examining the joint strengths. The results show that the Ni Ti transient liquid phase exists for only a short time and the strength of the interface formed within this duration is low. A large number of diffusion channels between the bonding zone metal and the ceramics could be produced after complete solidification of the liquid with a suitable bonding pressure. The microstructures of the strong joints with full solid state reaction untill the continious TiN layer formed are Si 3N 4/TiN/Ti 5Si 3+Ti 5Si 4+Ni 3Si/NiTi/Ni 3Ti/Ni.更多还原