【摘要】 力电耦合是大多数微电子机械系统 (尤其是以静电驱动的微机械 )的重要特征。文中采用有限元 (FEM )结合边界元 (BEM)的方法来混合求解MEMS中的力电耦合问题 ,利用自行研制的程序给出了几种典型构件 (平行板、悬臂梁和固支梁 )的分析结果 ,并同其他商业软件 (ANSYS和Intellisuite)的计算结果进行比较。同时 ,还将这种分析方法应用到微继电器的设计和MEMS构件残余应力的检测中更多还原

【Abstract】 Electro mechanical coupling is an important characteristic of most micro electro mechanical systems (MEMS). Coupled electro mechanical analyses of some typical micro components such as parallel capacitor structure, cantalever structure and end fixed beam structure, are presented based on a combination of boundary element method (BEM) and finite element method (FEM), to compare with the results from other softwares and approximate theory. Mechanical deformation of the microstructure is determined with the help of finite element computation by acting the obtained electronic charges as the external forces. This could be a common application of FEM by meshing the structure, specifying the material properties and boundary conditions. Most structures in MEMS components undergo deflection or movement, that results in big changes of the electrical field so that the charge distribution must be recomputed by BEM, based on the present configuration of the deformed structure whose surfaces form new boundaries of the boundary element analysis. The newly obtained electrostatic forces are then applied to redeform the structure and the computations of the multi field are performed so forth. Then the coupled electro mechanical analysis is applied in the design of bulk micromachined relay and the measurement of residual stress.更多还原