【摘要】 向聚砜 (PSF)中加入 5 %可原位成纤的半芳族热致液晶聚合物 (TL CP1) ,原位复合材料的表观粘度同PSF相比有明显降低 ,聚砜的加工性得到明显改进 ,同时复合材料的拉伸强度、弯曲强度、拉伸模量、弯曲模量均有所提高。形态研究表明 :在 TL CP含量为 5 %～30 %范围内 TL CP1均可在基体中分散并形成具有一定长径比的微纤。当 TL CP1用量高于 10 %时 ,原位复合体系呈现明显的皮 -芯形态 ,抗拉及抗弯曲性能发生劣化 ,但模量显著增加更多还原

【Abstract】 In order to improve the processing ability of Pol ysulfone(PSU) without losing its excellent mechanical and thermal properties, a semiaromatic polyester (exhibiting thermotropic liquid crystalline property in 2 25~340℃) was used to blend with PSU. The thermal properties, rheology, morpholo gy and mechanical properties of various blends having different ratios were inve stigated. When the loading level of the semiaromatic polyester is about 5%~10% b y weight, the blends exhibit lower viscosity, better mechanical properties. But the components of the blends are incompatible, blending high amount of the polye ster to PSU make its properties decrease.更多还原