【摘要】 采用模拟的方法 ,系统研究了Al/Cu接触反应及其液相行为的特点 ,并运用金属学中表面扩散和晶界扩散等理论进行了理论探讨。研究结果表明 ,在接触反应中Al/Cu共晶液相的行为包括 :一方面液相沿Al基体表面优先反应铺展 ;另一方面在基体深度方向上也有明显的晶间渗透作用。其中前者可以促进接头间隙内产生均匀的液相填充层 ;后者则是接头牢固接合的保障。同时为确定Al/Cu/Al接触反应钎焊工艺参数 ,研究了工艺参数对接触反应中共晶液相铺展行为的影响 ,结果表明 5 70～ 5 80℃的反应温度和 15min的保温时间是Al/Cu接触反应钎焊比较适合的工艺参数。在此基础上 ,本文采用Cu箔作中间层进行Al的接触反应钎焊 ,得到良好Al钎焊接头更多还原

【Abstract】 In this paper,the contact reaction between Aluminum and Copper and its liquid phase behavior were studied by means of experiment simulation and analysis based on the theory of surface and grain boundary diffusion in metallurgy.The results showed that the behaviors of Al/Cu eutectic liquid included reactive spreading on the surface of the base metal that forms a fillet in the clearance of the joint,and penetrating through grain boundary of base metal that makes sure the firm bonding of the joint.In order to gain the proper brazing parameters,the influence of conditions on the spread behavior of eutectic liquid in contact reaction process was also investigated,and the process parameters,i.e.temperature 570～580 ℃ and holding time 15min,for the reaction between Al and Cu were put forward.Based on the above investigating results,the sound contact reactive brazed joint of Al was produced by using Cu foil as an interlayer.更多还原