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钯选择性电沉积过程控制方式
Control Mechanism of Palladium Selective Electrodeposition
【摘要】 因为吸氢严重 ,一般的沉积工艺得到的钯镀层上存在气孔、裂纹等缺陷。利用正交设计研究了钯选择性电沉积过程。发现在移动阳极的作用下 ,钯选择性电沉积中离子扩散速度加快 ,使控制步骤由一般电沉积的扩散和电化学联合控制转为主要由电化学控制。AFM观察表明 ,镀层没有出现裂纹和气孔 ,质量颇好。
【Abstract】 The fabrication of palladium coating is difficult due to the well known hydrogen embrittlement. Pinholes and cracks often appear in the palladium coating because of hydrogen codeposition. Selective electrodeposition technology has been tried to solve these problems in this study. The orthogonal design experiments indicates that palladium selective electrodeposition is controlled by interfacial electron transfer, different from the joining control of interfacial electron transfer and diffusion of cell electrodeposition. The diffusion of palladium ions are accelerated by the opposite movement between the anode and cathode. The AFM morphology shows that pinholoes and cracks have been avoided.
- 【文献出处】 机械工程材料 ,Materials For Mechanical Engineering , 编辑部邮箱 ,2001年10期
- 【分类号】TQ153
- 【被引频次】3
- 【下载频次】102