节点文献
多晶硅热驱动微执行器的热流模型及数值模拟
Modeling and Numerical Simulation of Heat Flow for Polysilicon Thermally-driven Microactuators
【摘要】 首先建立了一个横向热驱动微执行器的热流模型。由于这个模型比较全面地考虑了热传导、空气自然对流和辐射散热等各种因素 ,因而较为正确地反映器件的温度分布。用合适的数值算法计算了温度分布 ,温度分布的结果可以作为进一步计算器件热应力和位移的基础。最后 ,根据模拟结果分析了一些对温度分布产生影响的因素
【Abstract】 A model of heat flow for a laterally driven thermal microactuator is developed which takes heat conduction、air natural convection and heat radiation into account. It may effectively describe the temperature profile within the microactuator. The temperature profile along the arms of the microactuator is numerically calculated, which gives out a basis of the calculation of the deflection for the actuator. Finally, possible factors affecting the temperature profile of the actuator are discussed.
- 【文献出处】 固体电子学研究与进展 ,Research & Progress of Solia State Electronics , 编辑部邮箱 ,2001年02期
- 【分类号】TN405
- 【被引频次】5
- 【下载频次】124