【摘要】 分层开裂是倒装焊微电子封装芯片失效的主要形式之一。本文在充分考虑填料与时间、温度有关的粘弹性性质的基础上 ,利用断裂力学的理论建立了填料与基板、填料与硅芯片的分层开裂的失效模型 ,并采用有限元软件 ANSYS进行模拟仿真 ,计算出裂纹能量释放率、应力强度因子、相位角等参数更多还原

【Abstract】 Interface delamination is an important failure mode for flip chip assemblies. In this paper, considering the time dependence and temperature dependence of the viscoelasticity of the underfill,the failure mode of interface delamination was established by the fracture mechanics approach. The mode was simulated by the software of Finite Element Analysis (ANSYS).The parameters of the energy releasing rate, the stress intensity factor and the phase angle have been calculated.更多还原