节点文献
化学镀可焊性锡基合金的研究进展
Progress of research on electroless plating of solderable tin alloy
【摘要】 本文综述了近 1 0年来化学镀可焊性锡基合金的研究现状及动态。列举了 4种不同镀液体系的典型配方及工艺 ,并对化学镀锡合金的未来发展提出了建议
【Abstract】 Current status and prospect of solderable electroless tin alloy plating were summarized with 18 references published in the recent decade. Four traditional plating solutions based on chloride, fluoboric, alkyl sulfonate and ethane sulfonate were exemplified. Suggestions were presented about the develoment of electroless plating of solderable tin alloy.
- 【文献出处】 电镀与涂饰 ,Electroplating & Finishing , 编辑部邮箱 ,2001年01期
- 【分类号】TQ15
- 【被引频次】29
- 【下载频次】237