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化学镀锡铅合金
Electroless Sn-Pb
【摘要】 研究了甲基磺酸体系化学镀锡铅合金。讨论了其中各组分的作用 ,并获得了最佳工艺条件。在此条件下 ,铜片上沉积速度能达到 14μm 30mi
【Abstract】 The electroless Sn Pb alloy plating process in methylsulfonic acid system was studied. The action of various components was discussed and the optimized operating conditions were also obtained. The deposition rate in the optimized operating conditions can rach 14μm/30min.
- 【文献出处】 电镀与环保 ,Electroplating & Pollution Contiol , 编辑部邮箱 ,2001年03期
- 【分类号】TQ153
- 【被引频次】17
- 【下载频次】231