【摘要】 通过理论分析与计算机模拟 ,给出了以提高跨导为目标的 Si/ Si Ge PMOSFET优化设计方法 ,包括栅材料的选择、沟道层中 Ge组分及其分布曲线的确定、栅氧化层及 Si盖帽层厚度的优化和阈值电压的调节 ,基于此已研制出 Si/ Si Ge PMOSFET器件样品 .测试结果表明 ,当沟道长度为 2μm时 ,Si/ Si Ge PMOS器件的跨导为 45 m S/ mm(30 0 K)和 92 m S/ mm (77K) ,而相同结构的全硅器件跨导则为 33m S/ mm (30 0 K)和 39m S/ m m (77K) .更多还原

【Abstract】 Through the theoretical analysis and computer simulation,the optimized design principles for Si/SiGe PMOSFETs are given,including the choice of gate materials,the determination of Ge percentage and the profile in SiGe channel,the thickness optimization of dioxide and silicon cap layer,and the adjustment of threshold voltage.In light of them,a SiGe PMOSFET is designed and fabricated successfully.The measurements indicate that the transconductance is 45mS/mm (300K) and 92mS/mm (77K) for SiGe PMOSFET’s (L=2μm),while it is 33mS/mm (300K) and 39mS/mm (77K) for Si PMOSFET.更多还原