【摘要】 介绍了倒装芯片凸焊点的焊点下金属（ＵＢＭ）系统，讨论了电镀Ａｕ凸焊点用ＵＢＭ的溅射工艺和相应靶材、溅射气氛的选择，给出了凸焊点ＵＢＭ质量的考核试验方法和相关指标。更多还原

【Abstract】 Various of UBM (Under Bump Metallurgy or Under Bump Metallization) systems for flip chip bumping are presented. This paper discussed the manufacturing of UBM for electroplating gold bumping, concerning in the sputtering process and selections of targets and sputtering gas. Test methods and related standards associated with UBM qualities are given.更多还原