【摘要】 探讨了用HCD法在玻璃基板上制备的Ti 43 .2 7%Ni形状记忆合金薄膜和经不同热处理后的组织结构。结果表明 ,当镀膜的基板温度较高时 ,所得的薄膜基本晶化 ,其组织为由马氏体、R相、母相和Ti2 Ni析出相等组成的多晶体。经热处理后 ,母相量增加 ,马氏体量减少 ,表明热处理使Ms 点下降。利用这一现象 ,可扩大记忆合金薄膜的使用温度范围。在由室温加热到 1 1 0℃的动态观察中发现 ,多晶体中的马氏体逐步缩小、消失 ,转变成母相、R相 ,表现出热弹性 ,并且伴随有Ti2 Ni相析出更多还原

【Abstract】 The morphology and structure of the SMA thin film of Ti 43.27% Ni formed by HCD sputter deposition on glass substrates were studied. The results showed that when the temperature of the substrate is sufficiently high in the process of sputter depositing film,the thin film is bassically crystallized and its morphology is polycrystal consisting of martensite, R, Ti 2 Ni and parent phase. Because the relative quantity of parent phase increases and that of martensite decreases after heat treatment, M s temperature drops,the using temperature range of SMA thin film is expanded. Observed in situ from room temperature up to 110 ℃,the martensite in the polymorphy is reduced continuously until it disappears, and all transformated into R,Ti 2 Ni and parent phase in the end, which means the martensite shows thermoelasticity.更多还原