【摘要】 采用统一型粘塑性本构 Anand方程描述了电子封装焊点 Sn Pb钎料合金的非弹性变形行为 ,基于 Sn Pb 合金的弹塑性蠕变本构方程和实验数据 ,确定了6 2 Sn36 Pb2 Ag、6 0 Sn40 Pb、96 .5 Sn3.5 Ag和 97.5 Pb2 .5 Sn四种钎料合金 Anand方程的材料参数 ,验证了粘塑性 Anand本构方程对 Sn Pb合金在恒应变速率和稳态塑性流动条件下应力应变行为的预测能力。结果表明 ,Anand方程能有效描述 Sn Pb钎料的粘塑性本构行为 ,并可应用于电子封装 Sn Pb焊点的可靠性模拟和失效分析更多还原

【Abstract】 In this paper, a unified viscoplastic constitutive law, the Anand model, was applied to characterize the inelastic deformation behavior for tin lead (SnPb) based solder alloys used in electronic packaging. The material parameters of Anand model for 62Sn36Pb2Ag, 60Sn40Pb, 96.5Sn3.5Ag and 97.5Pb2.5Sn solder alloys were determined from elasto plasto creep constitutive relations and experimental results. The determined material parameters and the specially viscoplastic constitutive relations of SnPb solders were tested and verified for the predictive capability of constant strain rate testing and steady state plastic flow. It is concluded that the viscoplastic Anand law can be applied for representing the viscoplastic deformation behavior of SnPb solder alloys at high homologous temperature. This viscoplastic law can be recommended for reliability simulation and failure analysis of SnPb solder joint in electronic packaging.更多还原