【摘要】 通过正交原理设计试验及优化方法寻找最佳参数 ,对陶瓷表面化学镀工艺进行了研究 .结果表明 :(1 )陶瓷化学镀铜结合强度较高 ,化学镀设备简单 ,成本低廉 ;(2 )陶瓷化学镀的最佳工艺配方为 :粗化 2 min,敏化液中 Sn2 +浓度为 1 5 g/L ,镀液 p H1 2 ,镀液温度45℃ .更多还原

【Abstract】 This paper, with orthogonality designing the experiment and finding the parameters through optimizing method as well, mainly discusses the chemical plating technology on the ceramics. The results of the experiment indicate that: (1) The combining strength is higher in the chemical plating copper on the ceramics;(2) The optimal technology of the chemical plating copper on the ceramics is that the treatment time is 2min in HF, Sn 2+ is 15g/L in the sensitizing liquid, pH is 12 in the chemical plating liquid, and the temperature is 45℃.更多还原