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(YCa)F3助烧AIN陶瓷的显微结构和热导率
Microstructure and Thermal Conductivity of Aluminium Nitride with (YCa)F3 as Sintering Aid
【摘要】 采用(CaY)F3为助烧结剂,低温烧结(1650℃, 6h)制备出热导率为208W/m·K的AIN陶瓷,在烧结过程中,热导率随保温时间的变化服从方程:λ(t)=λ∞-△λ(0)·e-t/r·用SEM、 SThM、 TEM和 HREM对 AIN陶瓷的显微结构及其对热导率的影响进行了研究,结果表明,晶粒尺寸对AIN陶瓷热导率的影响可以忽略,而分隔在AIN晶粒之间的晶界相会降低热导率。
【Abstract】 Aluminium nitride ceramics were successfully fabricated through low-temperature sintering by using (YCa)F3 as the sintering aid. AIN ceramics with a high thermal conductivity of 208W/m·K were obtained after the specimen was sintered at 1650℃ for 6h. Calculation based on the present and reported results led to an equation which describes the dependence of thermal conductivity of AIN on the soaking time in sintering: λ(t) =λ∞ -△λ(0)·et/r. SEM, TEM, SThM and HREM were employed to study, the microstructure-property relationship of AIN ceramics. It was concluded that AIN grain sizes have little effect on the thermal conductivity, while grain boundary phases deteriorate thermal conductivity.
【Key words】 aluminium nitride; sintering; thermal conductivity; microstructure; SThM;
- 【文献出处】 无机材料学报 ,JOURNAL OF INORGANIC MATERIALS , 编辑部邮箱 ,2000年04期
- 【分类号】TQ174
- 【被引频次】24
- 【下载频次】128