【摘要】 选用具有高导电、高导热性能的新型陶瓷Ti3SiC2做为弥散强化相，通过与Cu粉末高能球磨混合后，热压成一种新型弥散强化Cu材料机械性能测试表明，随着Ti3SiC2体积分数的提高，弥散强化,Cu的屈服强度和维氏硬度线性上升分析表明Ti3SiC2相的晶粒细化和位错塞积是主要强化机制，当颗粒粗化和团聚后Ti3SiC2的强化效果将明显减弱更多还原

【Abstract】 Ti3SiC2, a new ceramic with high electrical and thermal conductivity, was successfully incorporated into copper as disp ersion-strengthened (DS) phase by mechanical mixing method and hot pressure technology and a new high strength and high conductive DS copper was developed.The results of mechanical properties test show that Ti3SiC2 strengthening effect on copper is significat. With the incorporation of Ti3SiC2, the yield strength and Vickers hardness of copper increaselineally. The strengthening mechanisms of Ti3SiC2 consist of dislocation pile-up and grain refiningThe strengthening effect of Ti3SiC2 on copper was reduced due to particle clustering and coarsening.更多还原