【摘要】 研究了喷射沉积体积分数 1 0 % SiCp/60 66铝基复合材料的固溶温度。结果表明 ,Mg和Cu在界面的富集致使复合材料的固溶温度和过烧温度均低于基体合金。该复合材料的最佳固溶温度为 51 5℃ ,且在 540℃过烧。更多还原

【Abstract】 In this paper,the solution temperature of spray deposition for 10%vol SiCp/6066 Al composites has been studied.The results show that the solution and over heating temperature of this material are lower than those of the base alloy because of the segregation of Mg and Cu to SiCp/6066Al interfaces.The optimum solution temperature of the composite is 515℃,and the over heating temperature is 540℃.更多还原