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25AgCuZnCd钎料脆性的研究

Investigation of the Brittleness of 25AgCuZnCd Solder

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【作者】 张建智易丹青尹邦跃卢斌宁江天

【Author】 ZHANG Jan-zhi, YI Dan-qing, YIN Bang-yue, LU Bin, NING Jiang-tian (Central South University of Technology,Changsha 410083,China)

【机构】 中南工业大学!湖南长沙410083

【摘要】 25AgCuZnCd钎料在加工成形时常出现脆性 ,为此 ,本文对Ag25Cd20Cu55-xZnx钎料显微组织、微区化学成分、相及其结构、强度、塑性和熔化特性进行了较详细的研究。研究发现钎料的脆性与合金中的组织和相结构有密切联系 ,并指出 ,当w(Zn +Cd)≤45 %、合金中出现塑性相时 ,能同时满足钎料的钎焊性和加工成形性的要求。

【Abstract】 Because of brittle fracture of 25AgCuZnCd silver solder when it was formed,full studied on microstructure, composition of micro-zero, phase and structure, strength, plastic and dissolving characteristic of Ag25Cd20Cu55x-Znx solder were carried out. It was found that the brittleness of the solder was closely connected with its microstructure, phase and structure. And the experimental results indicated that if content of Zn+Cd was less than or equal to 454 percent(wt%)and plastic phase was found in solder, both braze welding and formability of solder could be satisfied.

【关键词】 AgCuZnCd钎料脆性
【Key words】 AgCuZnCdsolderbrittleness
【基金】 湖南省科委重点科研资助项目
  • 【文献出处】 湖南有色金属 ,HUNAN NONFERROUS METALS , 编辑部邮箱 ,2000年03期
  • 【分类号】TG425
  • 【被引频次】2
  • 【下载频次】64
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