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制备工艺条件对泡沫镍电阻率的影响

Technology Condition Effect on Electrical Resistivity of Nickel Foam

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【作者】 刘培生李铁藩付超吕明于青

【Author】 LIU Peisheng1,LI Tiefan1,FU Chao2,L Ming2,YU Qing2 (1.State Key Laboratory for Corrosion and Protection;2.Champower Co.Ltd., Institute of Corrosion and Protection of Metals, Chinese Academy of Sciences,Shenyang,110015,China)

【机构】 中科院防腐所金属防护国家重点实验室昌普科技发展有限公司!辽宁沈阳110015

【摘要】 本文探讨了不同的工艺条件对有机多孔体电沉积法所制泡沫镍电阻率的影响。发现两种导电化处理结果相差很大 ,化学镀镍所得产品的电阻率明显高于浸涂石墨基导电胶所得产品。而去除有机体的热处理 ,先在空气中短时间预烧再还原烧结 ,比直接在还原气氛中热解烧结所得产品的电阻率有所降低。

【Abstract】 Effect of several different technology conditions on electrical resistivity of the nickel foam produced by electrodeposition on the organic porous body has been investigated,and the results indicate that the product resistivity through chemical plating Ni is distinctly higher than that through soaking in graphite-base conductive colloid as to conductive treatment.While as for the thermal treatment eliminating organism,the resistivity of product through reduction-sintering for quite a long time after burning in air for a short time is a little less than that of product through direct reduction-pyrolysis.

【关键词】 泡沫镍工艺条件电阻率
【Key words】 nickel foamtechnology conditionelectrical resistivity
  • 【文献出处】 功能材料 ,JOURNAL OF FUNCTIONAL MATERIALS , 编辑部邮箱 ,2000年02期
  • 【分类号】TM24
  • 【被引频次】3
  • 【下载频次】217
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