【摘要】 亲水处理是硅片能否直接键合成功的关键。基于亲水处理的微观机理分析和不同清洗剂亲水处理的过程及效果 ,本文提出了独特的三步亲水处理法。这一方法既能顺利完成室温预键合 ,又能减少界面上非定形大尺寸SiOx 体的生成 ,避免了界面对电输运的势垒障碍 ,结果获得了理想的键合界面更多还原

【Abstract】 The successful silicon wafer direct bonding mainly depends on the good hydrophilicity treatment before prebonding.Based on the analysis of micromechanism of hydrophilicity treatment and effect of the different cleaning solution on the silicon surface,the unique three steps method of hydrophilicity treatment has been developed in the paper,which can not only realize successful bonding ,but also avoid the large size amorphous SiO x grown-up which causes the barriers on the electric transport in the bonding interface.As a result, the ideal bonding interface can be obtained by it.更多还原