节点文献
Cu-Ag-Si系钎料合金的开发研究
R & D on Cu-Ag-Si System Filler Metals
【摘要】 根据Ag -Cu -Si相图及Si对Ag -Cu合金性能影响的研究结果 ,采用DTA法测定了含量为 2 0 %~ 45%Ag、 1 %~ 7%Si的Cu -Ag -Si系列钎料合金的固液相线温度 ,并对钎料的综合性能进行了试验研究。结果表明 :Ag为 2 5%~ 45%、Si≤ 3%以及添加微量Fe、Ni、Co组元的Cu -Ag -Si系列钎料、具有良好的塑性和钎焊特性 ,可以满足电真空器件和其它构件在 80 0~ 850℃及 92 0~ 950℃二级钎焊要求。
【Abstract】 According to the phase diagram of Ag-Cu-Si system and influence of Si on Ag-Cu alloy properties,the solidus-liquidus temperature of Ag 20%~45%,Si 1%~7% and Cu-Ag-Si system filler metals were determined by DTA and their synthetic properties were studied.Result indicated:the Cu-Ag-Si system filler metals,which consisted of Ag 25%~45%,Si≤3%,and micro-additives,Fe,Ni,Co,had good plasticity and brazing property,satisfying graded brazing in the range of temperature 800~850℃ or 920~950℃ applied to vacuum electronic devices and some other components.
【Key words】 Cu-base alloy; Filler metal; Vacuum electronic device; Graded brazing; Synthetic propertp;
- 【文献出处】 贵金属 ,Precious Metals , 编辑部邮箱 ,2000年04期
- 【被引频次】7
- 【下载频次】145