【摘要】 研制开发了一种用于压力传感器芯片与 1 0 1玻璃基座相封接的三元系结晶性低温玻璃焊料 ,其基本成份为 Pb O:Zn O:B2 O3 =58:1 8:2 4 (% wt)。已用 DSC分析该玻璃焊料 ,显示在 51 0℃出现主晶相的熔化吸热峰 ,其开始熔化温度为 445℃。在硅芯片背面制备一过渡层 ,然后用此低温玻璃焊料将压力传感器芯片与玻璃基座封接在一起。封接温度为 530℃ ,低于铝硅合金相的低共熔温度 577℃。用这一封接技术制备的压力传感器有良好的技术性能 ,热漂移小且能耐沸水、耐油 ,耐 1 50℃热冲击。封接强度达 7MPa。更多还原

【Abstract】 A low temperature glass solder of ternary system with a stoichiometric composition PbO:ZnO:B 2O 3=58:18:24(%wt) has been developed for bonding pressure sensor chip to the glass substrate inside a covar package. A main thermal absorption peak for melting at 510℃ with its beginning temperature 450℃ was revealed using DSC instrument. After having deposited an intermediate layer on the back of pressure sensor chip this chip was bonded to the glass substrate with this low temperature glass solder at 530℃, which is lower than the eutectic temperature 577℃ for Al-Si binary alloy. The pressure sensors processed with this new technology have a good performance with a small thermal drift and can resist the boiling water and oil attack, and 150℃ temperature shock. The bonding strength reaches 7 MPa.更多还原