【摘要】 基于最小能量原理和焊点形态理论 ,以方形扁平封装器件 (QFP)焊点为例建立了细微间距 (FPT)器件焊点形态成形模型 ,运用有限元方法预测了QFP焊点形态 ,并运用该模型和有限元方法对QFP器件焊点三维形态问题进行了分析。更多还原

【Abstract】 As an example of fine pitch technology,solder joint shapes evolving model of quad flat package based on minimal energy principle and the theory of solder joint shapes was developed, the finite element method was employed to predict solder joint shapes of QFP. And the model was used to analyze the problems of three-dimensional solder joint shapes of QFP.更多还原