【摘要】 文中从固体界面间接触热阻形成机理出发,提出了一种强化接触导热的方法,给出了低温真空环境下,两种金属界面间在反复加载情况下的接触热阻值,对卸载过程接触热导率大于同次加载过程接触热导的实验现象产生机理进行了分析,并指出了下一步的研究方向更多还原

【Abstract】 In this paper, the mechanism of thermal contact conductance (TCC) is introduced at first, and the TCC of Al-Al, Cu-Cu interfaces at low temperatures are measured when load is cycling, then the mechanism of the experiment phenomenon is analyzed. Finally, a thermal contact conductance enhancement is proposed.更多还原