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碳化硅颗粒增强铝基复合材料(SiCp/2024Al)的扩散焊研究
DIFFUSION BONDING OF SILICON CARBIDE PARTICULATE-REINFORCED 2024 ALUMINUM COMPOSITE
【摘要】 采用加纯铝箔中间层的方法,研究了15%SiCp/2024Al复合材料的固态扩散焊结果表明:在温度为 570℃、压力为 16MPa、焊接时间为60min的条件下,获得了较高质量的复合材料扩散焊接头对接头进行的剪切强度试验和金相分析发现,焊接界面平行性特征不明显,中间层明显变薄的接头具有较高的剪切强度.扫描电镜观察分析显示,接头断口呈现明显的韧性断裂特征。
【Abstract】 Study on the diffusion bonding of 15%(vol.fraction)SiCp/2024AI composite in the solid state has been conducted by means of pure aluminium foil interlayer. The result showed that high quality joint has been obtained under the condition of T=570℃, P=16MPa and t=60min. The results of the shear strength test and metallographic examination showed that the joint, with parallel feature interface and interlayer obviously thinned, had higher shear strength. SEM fractographs of joint indicated that the fracture of the joint presented obviously ductile rupture.
【Key words】 aluminium matrix composite; silicon carbide particulate; diffusion bonding; interlayer;
- 【文献出处】 材料研究学报 ,CHINESE JOURNAL OF MATERIAL RESEARCH , 编辑部邮箱 ,2000年02期
- 【分类号】TG457
- 【被引频次】53
- 【下载频次】356