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焊补过程温度场的有限元法计算机模拟
Computer Simulation of Temperature Field During the Welding Process
【摘要】 开发了一种用于温度场模拟的有限元微机软件 ,实测结果证实了软件模拟的准确性。运用该软件的模拟结果分析了铸件溶解扩散焊的热影响区硬度升高的原因并给出了解决该问题的途径。
【Abstract】 The common finite element method microcomputer software for simulation of the temperature field is developed by authors. Its correctness is proved by testing results.This software is used to analyze the causes of hardness rising in heat effecting zone, and finally the approach to solving the problem is presented.
【关键词】 有限元;
计算机模拟;
焊接温度场;
【Key words】 finite element methods; computer simulation; welding temperature field?;
【Key words】 finite element methods; computer simulation; welding temperature field?;
【基金】 国家科技成果推广项目资助
- 【文献出处】 重庆邮电学院学报(自然科学版) ,Journal of Chongqing University of Posts and Telecommunications , 编辑部邮箱 ,2000年02期
- 【被引频次】8
- 【下载频次】109