【摘要】 目的　探讨Ti 75合金表面烤瓷的可行性。方法　采用电子探针界面分析及剪切强度测试的方法 ,考察金瓷界面的结合状态及结合强度。结果　Ti 75合金与低温瓷 (Ti Bond)的剪切强度为 (47 38± 7 95 )MPa ,与传统金瓷修复体 (NC VMK6 8)的剪切强度 (48 5 0± 7 6 0 )MPa相比 ,差异无显著性 (P >0 0 5 )。电子探针界面分析显示 ,Ti 75合金与低温瓷结合紧密 ,无裂隙 ,低温瓷对Ti 75有良好的浸润作用。同时 ,亦可见到Ti元素从Ti 75基体向瓷内扩散 ,Si、Sn等元素从瓷中向Ti 75扩散。结论　Ti 75合金可以作为口腔用烤瓷合金。更多还原

【Abstract】 Objective To study the feasibility of low fusing porcelain fused to Ti 75 alloy Methods The bond strength and interfacial state of porcelain titanium were observed by EPM analysis and shear test Results The results showed that the shear bond strength of 1ow fusing porcelain fused with Ti 75 alloy and the conventional porcelain fused to base metal alloy (NC VMK68) respectively were 47 38±7 95MPa and 48 50±7 60MPa There were no significant difference in the shear bond strength between the two results (P>0 05) The analysis of electron microprobe showed that there was no crack in the interface, the low fusing porcelain permeated Ti 75 alloy fairly , and titanium diffused from Ti 75 alloy to porcelain, and silicon, stannum diffused from porcelain to Ti 75 alloy Conclusion Ti 75 alloy can be regarded as a suitable alloy for low fusing porcelain更多还原