【摘要】 本文对电子元器件引线贮存一定时间后，可焊性下降的原因进行研究。采用数理统计方法，得出不同铋、锑含量的60焊锡镀层与铜基体间金属间化合物层生长规律。经方差分析，结果表明，微量元素铋与热浸镀温度间的交互作用对化合物生长影响最显著；热浸镀温度对其影响较显著；微量元素锑与热浸镀温度间的交互作用对化合物生长影响次之，微量元素铋的含量以及热浸镀温度和时间的交互作用对化合物生长有一定促进作用。并由实验计算出一定老化温度下的扩散激活能。分别得出焊接及引线表面涂敷用60焊锡中的最佳含铋量。更多还原

【Abstract】 The reason Why solderability of the lead of electron components went bad after storing in certain the was resezrched . The inflUenCe factors on the growth of intermetallic compounds for copper matrix coated on with the 60 solder containing different contents of bismuth and antimony were discovered.The variance analyses show that the effect r of interaction between force bismuth and the temperature of immersion plating on growth of in~ilies is mest remarkable. The temperature of immersion plating is mere rewarkable than trace antimony. Bismuth contents and the intereaction between temperature and the of immersion plating can promote growth of intermetallics . The activation energy of diffusion at aging temperature is calculated from the testing data. Optimal bismuth contents of solder (60 Sn, 40 Pb) for soldering and coating surface of the lead are gained respectively.更多还原