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激光脉冲重复频率对InSb划片的影响

Effect of Laser Pulse Frequency on Laser Scribing of InSb

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【作者】 齐军王昆林梁绵长朱允明

【Author】 Qi Jun 1,WANG Kun lin 1, LIANG Mian chang 1,ZHU Yun ming 2 (1 School of Mechanical Engineering,100084,China; 2 School of Technology, Macau University,China)

【机构】 清华大学机械工程学院!北京100084澳门大学科技学院

【摘要】 激光划片是半导体工业中一种有效的划片方法。目前在半导体材料划片中多采用调 Q Nd: Y A G 激光器。脉冲重复频率是这种激光器的一个重要参数,它影响着激光器的平均输出功率、脉冲峰值功率以及脉冲宽度等特性。因此,脉冲重复频率对激光划片效果有重要影响。研究了利用调 Q Nd: Y A G 激光对 In Sb 的激光划片,得出了刻槽深度和宽度与脉冲重复频率之间的关系。还从理论上探讨了划片时激光束和材料的相互作用过程,分析了各种刻槽形成的原因。

【Abstract】 Laser scribing technique is an effective scribing method in semiconductor industry and Q switched Nd:YAG laser is most widely used for scribing semiconductor material. Pulse frequency is an important factor of Q switched Nd:YAG laser which has effect on average power, peak power and pulse width of laser. Therefore, result of laser scribing is connected with pulse frequency. Laser scribing of InSb with a Q switched Nd:YAG laser was studied in this paper and the relationship between pulse frequency and groove depth and width has been obtained. The interaction process between laser beam and material was also analyzed theoretically and the reason of groove forming was discussed.

  • 【文献出处】 微细加工技术 ,MICROFABRICATION TECHNOLOGY , 编辑部邮箱 ,1999年03期
  • 【分类号】TN249
  • 【被引频次】5
  • 【下载频次】89
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