节点文献
低温APCVD法制备氮化硅薄膜
SILICON NITRIDE THIN FILMS PREPARED BY LOW TEMPERATURE ATMOSPTHERIC PERSSUER CHEMICAL VAPOR DEPOSITION
【摘要】 本实验用常压化学气相沉积法( APCVD) 在平玻璃基板上沉积了氮化硅薄膜,研究了基板温度、反应气体比例、热处理等对氮化硅薄膜制备的影响,发现在700 ℃以下,NH3/SiH4 流量比例为15/1 时制得较纯的氮化硅薄膜,比常规APCVD 法制备温度低大约150 ℃。
【Abstract】 Silicon nitride thin films were prepared on plate glass substrate by atmospheric pressure chemical vapor deposition,whose deposition temperature decreased about 150℃ than usual APCVD method.We studied technique factors which affect preparation of Si 3N 4 films,such as temperature of substrate,ratio of gas,thermal treatment,and found out that high purified Si 3N 4 were deposited when the ratio of NH 3/SiH 4 was 15/1 and the temperature was lower than 700℃.
【基金】 国家自然科学基金;浙江省“151”人才工程资助
- 【文献出处】 陶瓷学报 ,JOURNAL OF CERAMICS , 编辑部邮箱 ,1999年03期
- 【分类号】TN304.55
- 【被引频次】20
- 【下载频次】182