【摘要】 讨论了在氧化铝基板上的厚膜应用领域中采取直接电镀的方法。研究了建立在钯涂层、碳涂层和导电聚合物基础上的三种直接电镀的方法，测定和比较了它们与传统电镀／ 化学镀技术的操作步序、电镀速度和膜层结合力等技术指标。更多还原

【Abstract】 This paper discusses the application of direct plating method, originally developed for PCBs, to alumina thick film substrates. Three direct plating technologies, i.e. palladium coating, carbon coating and conductive polymers were investigated. Process handling, plating speed and adhesion strength of the metallization were determined and compared with the results achieved by the conventional electroless/electroplating technology.更多还原