【摘要】 采用真空扩散焊接方法研究了同质及异质ＳｉＣｐ增强Ａｌ基复合材料的连接特性，考察了ＳｉＣｐ体积分数变化及插入中间合金层对同质及异质Ａｌ合金基复合材料真空扩散焊接质量及接头性能的影响．研究结果表明，无论同质还是异质Ａｌ合金基复合材料，真空扩散焊接头的强度均随ＳｉＣｐ体积分数的增加而降低；获得满意的异质ＳｉＣｐ增强Ａｌ合金基复合材料的真空扩散焊连接远比同质材料时困难。研究结果还表明，无论同质还是异质Ａｌ合金基复合材料的真空扩散焊，采用合适的中间合金层可以明显改善接头连接质量，扩散焊接头的强度明显高于无中间合金层的接头。更多还原

【Abstract】 The present work has investigated the joining characteristics of SiCp reinforced aluminiummatrix composite(SiCp -reinforced AMC) by vacuum diffusion bonding process. The joining performancesof similar and dissimilar composites have been studied in detail, and the influence of the insert alloy layeron bonding quality and the property of the joints has also been estimated. The experimental resultsindicate that the strength of diffusion bonded joints decreases with increase SiCp volume percentage,and the vacuum diffusion bonding of dissimilar SiCp-reinforced AMC with satisfactory joining quality ismore difficult than that of similar composites. For the diffusion bonding of either similar or dissimilarSiCp-reinforced AMC, the suitable insert alloy layer can improve evidently the joining quality of joints,and the strength of diffusion bonded joints using the insert alloy layer is apparently higher than that of noinsert layer.更多还原