【摘要】 讨论了电沉积的工艺条件（pH值、H₃PO₃的含量、电流密度）对沉积层组成的影响；热处理对Ni—P合金层结构的影响，以及合金层组成和结构与耐蚀性的关系。结果表明，随pH值的升高，H₃PO₃含量的升高，电流密度的降低，沉积层中的P含量逐渐增大；高合P量的合金层在350℃左右时，差热曲线上出现-尖锐的放热峰，即合金层开始品化，析出Ni₃P相；Ni—P合金层随含P量的升高，耐蚀性增强。热处理后的合金层耐蚀性能降低。更多还原

【Abstract】 The Influence of the technical conditions (such as pH, the percentage of H3PO3, the density ofelectricity) on the composition of the deposit, and of the heat treatment on the structures of Ni-P alloytier, and the relation between the composition of the alloy tier and the corrosion-resisting properties arediscussed. It proves that percentage of P in the deposit increases with pH and the percentage of H3PO3,and decreases with the density of electricity, about 350℃, in the thermogram of the high- phosphoricpercentage alloy tier, a sharp irradiative apices appears. It seems that the alloy tier begins to crystallizeand the Ni3P phase separates out, the corrosion- resisting properties of Ni-P and its alloy tier increasewith Phosphoric. On the contrary, the corrosion-resisting properties of alloy tier reduces after beingheated.更多还原