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低温化学镀Ni-Cu-P三元合金工艺
TECHNOLOGIC ON ELECTROLESS PLATING OF Ni-Cu-P ALLOY IN LOW TEMPERATURE
【摘要】 在以柠檬酸钠为络合剂的化学镀Ｎｉ－Ｃｕ－Ｐ的合金镀液中，添加三乙醇胺辅助络合剂，增加了镀液的稳定性，扩大了施镀范围，可在４０～７０℃下施镀。硫酸镍及次亚磷酸钠的用量，对沉积速度有一定的影响。该工艺可用于黄铜基质材料和低碳钢施镀。
【Abstract】 When triethanolamine is added in the Ni-Cu-P alloy containing sodium litrate, the stability of Ni-Cu-P alloy system is strengthened and the range of coating temperature is widened. The coating can be operated in 40～70 ℃. Effect of nickel sidphate (NiSO 4) and sodium hypophosphinate (NaH 2PO 2) exerts some influence on precipitating velocity. It is applied in the coating of brass and low-carbon steel.
- 【文献出处】 桂林工学院学报 ,JOURNAL OF GUILIN INSTITUTE OF TECHNOLOGY , 编辑部邮箱 ,1999年02期
- 【分类号】TQ153.2
- 【被引频次】5
- 【下载频次】121