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偶联剂对铜系复合涂料导电稳定性的影响

EFFECT OF COUPLING AGENT ON ELECTRIC CONDUCTIVITY STABILITY OF COPPER FILLED COMPOSITE PAINTS

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【作者】 林硕吴年强李志章

【Author】 Lin Shuo Wu Nianqiang * Li Zhizhang * (Department of Mechanical Engineering, *Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027)

【机构】 浙江大学机械系!杭州310027浙江大学材料系!杭州310027

【摘要】 采用硅烷偶联剂对铜粉进行处理,使导电涂料的电阻率降低一个数量级,并且经500 小时的耐候性实验,电阻率保持稳定。研究了偶联剂对铜粉氧化的抑制作用机理。红外光谱(FTIR)表明,偶联剂可以和铜粉表面以氢键、共价键结合,形成一层保护膜防止铜粉氧化。

【Abstract】 In the present work, the electric resistance of copper filled composite paint is reduced ten times by addition of coupling agent. And the electric conductivity of the composite paint keeps stable during 500 hours of exposure to air. The mechanism of resisting oxidation is investigated by Flourier Transfer Infrared Spectrometry. It is suggested that the hydrogen bond and the covalence bond between coupling agent and the copper powders are formed. This leads to formation of an oxidation resistant film on the copper powders.

【关键词】 硅烷偶联剂铜粉氧化
【Key words】 coupling agentcopper powderoxidation
  • 【文献出处】 复合材料学报 ,ACTA MATERIAE COMPOSITAE SINICA , 编辑部邮箱 ,1999年04期
  • 【分类号】TQ630
  • 【被引频次】66
  • 【下载频次】368
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