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快速退火BF~+注入非晶硅薄膜的显微分析
Microscopic analysis of rapid annealed amorphous silicon film implanted with BF~+.
【摘要】 将具有能量92ke V、剂量1×1015/cm 2 的 B F+ 注入由 P E C V D 方法制备的a Si∶ H 薄膜中,然后用功率为 60 W 、束斑直径 02cm 的 C W C O2 激光器进行 10s 快速退火。再用扫描电子显微镜( S E M)进行显微形貌观察。分析结果指出:由于 B F+ 的注入,使a Si∶ H 薄膜中产生了多重结构缺陷,其表面轮廓是类似矩形和方形的图形;发现退火中的晶化是从这些缺陷的棱边开始。最后对晶化过程和机理进行了讨论。
【Abstract】 BF\++ with 92keV and 1×10 15 /cm\+2 was implanted into a\|Si∶H film prepared by PECVD,then implanted sample has been rapid annealed using CWCO\-2 Laser with output of 60W and spot size 0 2cm in diameter at 10s time.Microscopic topographies analysis with SEM indicate that:Under our annealing condition,the profiles of multi\|structure defects in a\|Si∶H film produced by BF\++ implanting are some shapes of rectangle\|like and square\|like.Crystallization started from the edges of multi\|structure defects.Crystallized procedure and the mechanism have been discussed.
【Key words】 hydrogenated amorphous silicon film; rapid annealing; ion implantation; crystallization;
- 【文献出处】 电子显微学报 ,JOURNAL OF CHINESE ELECTRON MICROSCOPY SOCIETY , 编辑部邮箱 ,1999年04期
- 【分类号】TN304.055
- 【下载频次】52