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硫脲及其衍生物对铜阴极电沉积影响的电化学研究

Influence of Thiourea and Its Derivate on the Process of Cathodic Electrodeposition of Copper

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【作者】 董云会邹爱红赵云霞

【Author】 Dong Yunhui * Zou Aihong ZHao Yunxia (Dept. of Materials, Zibo College, Zibo 255200)

【机构】 淄博学院材料系!淄博255200

【Abstract】 The effects of thiourea and its derivate on the electrodeposition of copper from the dilute acid sulphate solutions have been studied by using potential sweep techniques at quasisteady state. Limiting current densities( I d),exchange current densities( i 0) and αn are obtained by data processing with the least square method.Thiourea has a depolarizing effect on the copper depositing at concentrations below 8 mg·L -1 ,and a polarizing effect at higher concentration (>10 mg·L -1 ),and it changes the mechanism of copper deposition reaction.Propenyltiourea and Phenylthiourea have a depolarizing effect on the copper depositing,but the mechanism of copper deposition reaction is not changed.XRD results indicate with increasing thiourea concentration the predominant oriedthation of copper deposition from (220) to (111).

【关键词】 ThioureaDerivateCopper depositionMechanismTexture
【Key words】 ThioureaDerivateCopper depositionMechanismTexture
  • 【分类号】O646.54
  • 【被引频次】12
  • 【下载频次】221
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