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金刚石表面电镀铁钨合金的研究
Study of Iron-Tungsten Alloy Electroplating on Diamond Surface
【摘要】 由于金刚石为非金属材料,与金属或合金间存在很高的界面能,从而影响了其结合强度。为提高金刚石与金属表面间的结合力,采用在金刚石表面先化学镀镍钨磷再电镀铁钨合金,通过扫描电镜和X射线衍射分析所得镀层,镀层中的强碳化物生成元素钨与金刚石表面碳原子反应生成金属碳化物,从而提高了金刚石与金属表面的结合力。此外,分析了电镀过程中出现漏镀的原因并提出了解决方法。
【Abstract】 As nonmetallic materials, diamond has high interfacial energy with metallic surfaces, resulting in low coherence. Electroless nickel-tungsten-phosphorus plating and subsequent iron-tungsten alloy electroplating on diamond surface were adopted. The morphology and composition of the obtained deposits were analyzed by means of SEM and X-ray diffraction, with results that tungsten which is a carbide-forming element reacted with carbon atoms of the diamond surface, and coherence between diamond and metal surface was enhanced. Defective deposits were investigated and method of prevention has been proposed.
- 【文献出处】 电镀与涂饰 ,ELECTROPLATING & FINISHING , 编辑部邮箱 ,1999年02期
- 【分类号】TQ153
- 【被引频次】20
- 【下载频次】227