节点文献
多层片式抗EMI滤波器工艺研究
A Study on the Process of Multi Layer Chip Anti EMI Filter
【摘要】 以NiZnCu 铁氧体为原材料,通过适量掺杂Bi2O3 作为降温烧结剂,将铁氧体烧结温度降至920℃,从而实现NiZnCu 铁氧体与Ag 内电极的共烧匹配。再经特殊设计及技巧改良,制作出磁性能优良的多层片式电感器(MLCI)和非常适合高密度表面封装技术(SMT)要求的多层片式滤波器(MLCF)
【Abstract】 By adding Bi 2O 3 to NiZnCu Ferrite,the sintering temperature is decreased to 920℃,which makes it possible for the co sintering of NiZnCu ferrite and Ag internal electrode.As a result,a multilayer chip inductor with excellent electromangetic properties and filter from it suitable for high density surface mounted technology are made by special design and improved skill.
- 【文献出处】 磁性材料及器件 ,JOURNAL OF MAGNETIC MATERIALS AND DEUICES , 编辑部邮箱 ,1999年04期
- 【分类号】TN713
- 【被引频次】3
- 【下载频次】76