【摘要】 在硅杯背面制备过渡层，然后用低温玻璃焊料将压力传感器芯片与玻璃基座封接在一起，有效地降低了热应力。采用这种新工艺制造出的压力传感器，性能良好，封接强度达７ＭＰａ，提高了可靠性与稳定性。更多还原

【Abstract】 By depositing an intermediate layer, then the pressure sensor chips are bonded to the glass substrates with low temperature glass solder ,that decreases the thermal stress obviously.Pressure sensors made with this new technique have good performance,and the bonding strength reaches 7 MPa.The reliability and stability are improved.更多还原