节点文献
电沉积Ni-W-P非晶态合金工艺研究
Study on Aluminizing Deeply into Pure Copper
【摘要】 研究了Bi-W-P非晶态合金的电沉积方法;讨论了电沉积液的温度、pH值和电流密度对镀层结构及成分的影响;同时对电沉积液的pH值和电流密度对镀层的硬度及耐蚀性的影响进行了研究。
【Abstract】 The effect of the parameters of the captioned process on the depth.aluminium content and quality of the aluminium containing layer is stuJied. A process in which aluminium paste deeply penetrates into pure copper is recommended. It is characterized by high speed, short process time.easy operation and low cost.
- 【文献出处】 表面技术 ,Surface Technology , 编辑部邮箱 ,1999年01期
- 【分类号】TQ153
- 【被引频次】12
- 【下载频次】114