【摘要】 晶片级测试方法是半导体器件（ＶＬＳＩ）金属化可靠性试验中的一种新方法，本研究在现有设备的基础上进行了一系列的设计和改进，建立了一套由微机控制的晶片级金属化电徙动测试系统，为金属化可靠性测试和在线监测的研究奠定了良好的基础。更多还原

【Abstract】 In this study,a new system for wafer level testing has been built,which will be used for electromigration experiment of metallization in semiconductor devices and VLSI.The system is controlled by a computer,which includes three parts:IEEE 488 devices,wafer testing form and temperature controller.The test program is compiled in visual basic.更多还原